400-9988-118
中文|English



ASYMTEK Spectrum II Premier S2-900P Fluid Dispensing System


Developed for leading-edge fluid dispensing applications, the Spectrum? II Premier, equipped with the IntelliJet? Jetting System, provides the latest technology in closed-loop process controls, vision targeting, and jetting

? The Spectrum II Premier platform delivers precision, quality, and process controls for complex dispensing applications in semiconductor and mobile electronics packaging
? Pre-configured with the IntelliJet system, the ideal jet for the smallest dots and lines, highest frequency, and simplest maintenance
? Integrated Monocle? Vision Package targets multiple dispense locations with an expansive, high-resolution field of view and 5-channels of independent light control
? Key features are standard on the Premier system, like Fids-on-the-Fly? and wafer programming software, non-contact laser height sensing, and substrate heating
? The Premier delivers increased productivity for cutting-edge applications, such as wafer-level packaging, advanced camera module assembly, and underfill dispensing for high-density PCBs now and into the future

The future of fluid dispensing is the new Spectrum II Premier system from Nordson ASYMTEK, built on the popular Spectrum II platform. The Spectrum II Premier, equipped with the IntelliJet jetting system, dispenses small dots for advanced packaging applications and enables tight dispense weight accuracy and control with Nordson ASYMTEK's patented Calibrated Process Jetting (CPJ). High frequency jetting allows for faster line speeds to increase throughput and meet the demands of next-generation semiconductor packages that require cutting-edge dispensing capabilities, like wafer-level packaging, advanced camera module assembly, and underfill dispensing for high-density PCBs. The Spectrum II Premier system comes standard with the Monocle Vision Package, which improves fiducial finding and targeting accuracy. Additional built-in software capabilities significantly reduce programming time for complex dispense patterns such as multi-pass, non-linear wafer dispense patterns.

Features

? Equipped with the IntelliJet Jetting System
? High Resolution Monocle Vision Package
? Fids-on-the-Fly software for high-speed fiducial capture
? Non-Contact Laser Height Sensor
? Calibrated Process Jetting (CPJ)
? Fluidmove? software
? Dual-Simultaneous and Dual-Action Dispensing - optional
? Tilt Dispensing: Single-Axis and Programmable Tilt + Rotate - optional
? Dual-lane Dispensing for increased throughput - optional
? Pre-/Dispense/Post-heating to enhance underfill flow-out and curing - optional
? MH-900 material handlers - optional
? Multiple Applications (underfill, cavity fill, die attach, precision coating, encapsulation, and more)