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MatriX X2# Automated X-ray inspection system


 

Transmission & 3D SFT?

The X2# is an advanced In-line X-RAY inspection system designed for high-speed automatic inspection in production lines. Transmission X-RAY technology is combined with patented Slice-Filter-Technology (SFT) for double-sided PCB assembly and component inspection. The X2# features fully automatic inspection based on a CAD compiled inspection list and uses an inspection model library for the test-strategy definition. The motion system as well as the image acquisition chain meets all demands of high-speed inspection.

X-ray System Features

? Flexible Inline AXI system
? 3-axes programmable motion system with variable FOV
? Maintenace free sealed tube and digital flatpanel technology
? In-line pass through board handling with automatic width adjust
? Automatic grey-level and geometrical calibration
? Full product traceability via customized MES-Interface (incl. 1D/2D barocescan)
? Optional: Combination with MatriX AOI module

APPLICATIONS

ELECTRONIC COMPONENTS AND SOLDER-JOINTS
A unique advanced algorithm library is available for electronic applications specifically for component and solder-joint inspection on PCB, hybrid or chip level assembly processes.

? All standard SMD components
? Specific BGA and QFN algorithms
? Cooling plates/heatsink void inspection


SPECIFICATIONS

Physical Dimension
Dimensions: 1670 mm (H) x 3100 mm (W) x 1760 mm (D)
Adjustable conveyor height: 890 – 980 mm
Weight: 3000 kg
Safe Operating Temperature: 15° - 32 °C,optimal 20° - 25° C
Power Consumption: max. 6 kW
Line Voltage: 400 VAC, 50/60 Hz 3 phase, 16 A,208 VAC, 50/60 Hz 3 phase, 25 A
Air: 5-7 Bar, < 2 l/min, filtered (30μ), dry, oil free

Motion System
High-speed sample table
Driving distance X,Y : 510 x 410 mm
X-Ray tube (Z): 0 - 150 mm

X-ray Source (sealed tube)
Energy : 150 kV/75 W
Focal Spot Size: 5 - 7 microns
X-Ray Tube Orientation: End window tube

Digital Image Detector
Grey value resolution: 14 bit
Video output: Camera link interface
Detector Type A: CMOS Detector (1,5k x 1,5k)
Active inspection area: 115 x 115 mm

Image Performance
High-resolution setup
Transmission FoV: 0.4” (10 mm) to 1.2” (30 mm)
Object resolution (@min. FOV): 3-5 μm

Sample Inspection Parameter
Max. board size: 20” x 16” (510 x 410 mm)
Min. board size: 4” x 3” (100 x 80 mm)
Max. inspection area: 19”x 16” (480 x 400 mm )
Max board weight: 11 lbs (5 kg)
Board thickness: 0.03” – 0.2” (0,8 – 5 mm)
Assembly Clearance
Topside (incl. board thickness): 30 mm
Bottom side (excl. board thickness): 50 mm
Edge clearance for clamping: 3 mm

Safety / Regulatory
Full safe, interlocked enclosure. Complies with all U.S. and International standards for cabinet radiography systems. CDRH directives / CE compliant.