Remove individual layers of mold compound down through the lead frames to the substrate.
100% controllable by the operator through our Graphic User Interface.
Full, Localized，or Bevel Decapsulation can be achieved.
Reduces the amount of chemical processing necessary.
Package Pre-opening: plastic, ceramic and MEMS
Pre-cavitation of power devices
Circuitry can often be revealed without acid
Complex-shaped cavities can be made
Exposure of components without destruction of Al, Cu, Au bond wires
For applications requiring subsequent acid cleanup,low temperature, low corrosion conditions can be used.
Glob top removal (Wlip chipped or wired dies on PCB or Ceramic)
Cross section preparation
Thin PCB cut