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SST 1200 Table Top Furnace


 

 

 

 

 

 

 

The Model 1200 is a table top vacuum and pressure furnace designed for process development and low volume production of flux-free and void-free soldered joints in microelectronic packages and components. The station is easy to use and designed for a wide variety of soldering tasks. A ramping temperature controller is combined with customized PLC's to provide automatic process control.

Processes

Void-Free Die Soldering
Void-free die and substrate solder attach is used to create a uniform thermal interface for high reliability microelectronic devices.

Hermetic Package Sealing
Hermetic package sealing uses solder or glass to create a barrier to moisture which will damage sensitive electrical circuit components.

Applications

Automotive Diodes
CPV Solar Cell Modules
Fiber Optic Devices
Flip Chips
GaN MMIC's
Hearing Aid Amplifiers
Hermetic Feed-Throughs
Implantable Medical Devices
Laser Pump Diodes
LED Lamps and Heaters
Microwave Packages
Miniature Crystals
MMIC's
Oscillators
Pacemakers
Power Modules
Pressure Sensors
Resistor Networks
RF Amplifiers

Specifications

Maximum Operating Temperature: 450°C
Minimum Vacuum Level: 100 millitorr (0.13 mbar)
Maximum Operating Pressure: 50 psig (4.5 bar)
Heated Area: 5.0 x 4.0 in (125 x 100 mm)
Recommended Process Area: 4.5 x 3.5 in (115 x 90 mm)
Thermal Uniformity Process Area: 5°C or better
Maximum Heating Rate in Vacuum: 4°C/sec
Process Gasses: N2 plus one optional inert gas at 75 psig (3.5 kg/cm2)
Cooling Water: Optional - 1 gpm at 30 psig (4 lpm at 2kg/cm2)
Electrical Service: 3.0 kVA max, 110 or 220 volts, single phase, 50/60 Hz
Overall Size (W x D x H): 30.5 x 25 x 19 in (78 x 64 x 48 cm)
Weight: 180 lb (80 kg)