The Model 3130 is a vacuum and pressure furnace that provides precise automatic control of heating to 500°C (1000°C optional) and cooling in an inert gas environment from vacuum levels of below 50 millitorr to pressures exceeding 50 psig. Process profiles are easily created, and the process data can be analyzed off-line. The system is used in both production and research environments for flux-free soldering, brazing, annealing and glass sealing of components and packages for microelectronic applications.
Void-Free Die Soldering
Void-free die and substrate solder attach is used to create a uniform thermal interface for high reliability microelectronic devices.
Glass to Metal Sealing
Glass to metal sealing is performed at high temperatures to created hermetic seals for electrical feedthroughs and electronic components.
Hermetic Package Sealing
Hermetic package sealing uses solder or glass to create a barrier to moisture which will damage sensitive electrical circuit components.
CPV Solar Cell Modules
Fiber Optic Devices
Gated Light Arrays
Hearing Aid Amplifiers
High Accuracy Gyroscopes
Implantable Medical Devices
Laser Pump Diodes
LED Lamps and Heaters
|Operating Temperature Range
||100 to 500°C (1000°C optional)
|Thermal Work Zone
||35 in2 (225 cm2) maximum
|Minimum Vacuum Level
||< 50 millitorr (< 0.067 mbar)
|Maximum Chamber Gas Pressure Level
||60 psig (5 bar)
||N2 required, (Ar He, forming gas optional) @ 90 psig (7 bar) minimum pressure
||208-240 volts, 50/60 Hz, single phase, 60 amps, 5 kW average, 13 kW peak
||Required 2 gpm (8 lpm) @ 20-25°C, 2 kW minimum, 30 psig (2 bar) pressure differential
|Work Surface Height
||38 in (96 cm) adjustable
|Overall Size (W x D x H)
||54 x 43 x 43 in (137 x 109 x 135 cm)
||1200 lb (545 kg)