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SST 518 Vacuum/Pressure Furnace


 

 

 

 

 

The Model 518 Vacuum/Pressure furnace provides the right combination of performance and value for use in R&D labs to high mix/low volume production environments. Void-free, flux-free solder joints are reliably obtained through a carefully controlled and sequenced combination of heat, vacuum, and pressurized inert gas.

Applications

Void-Free Eutectic Die Attach
Flux-Free Solder Process Development
Assembly of High Reliability Microelectronic Packages
Hybrid Microelectronic Circuit Assembly
Fiber Optic Package Assembly
Ceramic Package Sealing

Specifications

Operating Temperature Range 100 to 500°C
Thermal Work Zone 9 x 9 in (230 x 230mm)
Minimum Vacuum Level 50 millitorr
Maximum Gas Pressure Level 40 psig (3.7 bar)
Process Gasses N2 plus one option inert gas
Electrical Service 8.1 kW maximum, 50 or 60 Hz, 110-120v; 380 volt 3 phase
Cooling Water Required 2 gpm (8 lpm) @ 20-25°C, 2 kW minimum, 30 psig (2 bar) pressure differential
Chamber Depth 4 in (100 mm)
Temperature uniformity <+/- 1%
Overall Size (W x D x H) 40 x 35 x 42 in (102 x 89 x 107 cm)
Weight: 800 lb (360 kg)